Our design office is specialized in electronics
We carry out the electronic design of electronic products and embedded systems: feasibility study and electronic diagrams, electronic CAD of printed circuit boards (PCB routing) and manufacture of electronic cards.
Located in Grenoble, we work with research laboratories and semiconductor manufacturers who challenge us on advanced technologies. We have important know-how in highly technical electronic cards (HDI, high frequencies, multi layers …).
Our customers benefit from our experience in a wide variety of projects as well as our network of qualified subcontractors in the field of electronics, but also in complementary sectors such as mechanics or plastics.
What customers appreciate about us:
- The quality of our works and the project management.
- The expertise of our engineers and their ability to provide relevant technical solutions.
- The proximity service with regular meetings with our customers.
- The flexibility of our company to adapt to the specific needs of our customers.
- The transparency , we always provide the source files of our projects.
- The stability with a low turn over within our teams and a real knowledge of our customers.
Electronic study & diagrams
We design your electronic cards.
- Digital electronics (MCU, FPGA, CPLD),
- Analog electronics (capteurs, filtres…),
- Wireless (RFID, ZigBEE, Lora, Bluetooth, Wifi…)
- Networks (USB, Can, Ethernet IP…).
Electronic CAD – Printed circuit board routing (PCB)
We do the electronic CAD of the circuit board.
- Analog, digital, mixed and HF circuit,
- Adaptation and impedance control,
- BGA routing (pitch <400μ), DDR, Flex (pitch <80μ),
- Complex stack-up, up to 30 layers,
- Compliance with IPC standards.
Electronic card manufacturing
Quality manufacturing and local service.
- Single / Double Sided / Multi Layers,
- Flex / flex-rigid,
- Laser micro-vias, blind and buried holes,
- High temperature and RF materials,
- HAL, chemical silver, nickel-gold chemical …
Achievements in electronic design
22-layers printed circuit board,
BGA pitch of 0.4, 4 + 4 laser levels,
HTG material, Class 8, NiAu chemical,
Matched impedance tracks same length.
Mechanical design of the molded box,
6 layers card, FR4 Tg130,
Portable medical device on battery.
Assembly 2xBGA 512-0.5,
MC6, class 9.
FR4 material Tg180 + KAPTON 100μ,
Thickness 8 / 10th, CU 17/35 μm,